Servo Control and Drive Technology
Force Control
Precision Force Control for Advanced Semiconductor Packaging and Electronics Manufacturing
Advanced semiconductor packaging and electronics assembly/test applications require highly accurate control of forces applied by precision motion stages during a contact-based process. ACS’ Force Control algorithm, available in select servo drives, solves challenges associated with meeting the demanding throughput and accuracy targets of these applications:
- Detecting contact reliability (without false positives or negatives) and switching instantaneously from position control mode to force control mode
- Settling to the target force immediately after contact
- Performing rapid actuator moves without exciting resonances
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Key Benefits:
- Can achieve high levels of force control accuracy (e.g. +/-0.01N)
- Enables high levels of stage acceleration (e.g. >>1G) and process throughput
- Straightforward configuration procedure
- Suitable for Force Sensor and “sensorless” use cases
- Suitable for voice coil stages, linear motor stages
Key application use cases:
- Hybrid bonding
- TC (thermo-compression) bonding
- Die bonding
- LED bonding
- Wire bonding
- Wafer probing and test
- Silicon Photonics assembly and test
- Electronics assembly and test