As semiconductor devices continue to evolve toward heterogeneous integration and 3D architectures, bonding technologies such as hybrid bonding and thermal compression bonding (TCB) have become foundational to advanced packaging. These processes—spanning wafer-to-wafer (W2W), die-to-wafer (D2W), and die-to-die (D2D) bonding—place unprecedented demands on motion systems.

Among these demands, force control is emerging as a critical enabler of both process performance and yield.

Why Force Control Matters in Advanced Bonding

Hybrid bonding and TCB processes rely on precise mechanical interaction between ultra-flat, nano-scale surfaces. The goal is to achieve strong electrical and mechanical interconnects while avoiding damage to fragile structures such as copper pads, dielectric layers, and ultra-thin wafers.

Key process sensitivities include:

• Contact force magnitude
• Force uniformity across the bonding interface
• Force timing and ramp rates
• Dynamic switching between position and force modes

Inadequate force control can lead to:

• Voids or incomplete bonds
• Die cracking or warpage
• Misalignment during bonding
• Reduced yield and long-term reliability risks

This is particularly critical in hybrid bonding, where extremely fine interconnect pitches demand sub-micron alignment combined with tightly controlled force application.

Force Control Challenges Across Bonding Modes

Wafer-to-Wafer (W2W) Bonding

W2W bonding requires applying force uniformly across an entire wafer surface.

Key challenges:

• Maintaining global planarity and force uniformity
• Managing wafer bow and thermal expansion
• Avoiding localized over-force that can damage structures

Force control systems must ensure:

• Smooth force ramp-up across large surfaces
• Stable force regulation during thermal cycles

Die-to-Wafer (D2W) Bonding

D2W bonding introduces variability as individual dies are placed on a wafer.

Key challenges:

• Compensating for die height variation
• Achieving repeatable force at each placement location
• Maintaining throughput with rapid pick-and-place cycles

Here, force control must be:

• Fast and responsive for high-throughput placement
• Capable of on-the-fly contact detection
• Robust to part-to-part variation

Die-to-Die (D2D) Bonding

D2D bonding pushes precision even further, often used for chiplet integration.

Key challenges:

• Extremely small bonding areas
• High sensitivity to force overshoot
• Tight coupling between alignment and force application

This requires:

• High-bandwidth force loops
• Precise synchronization between motion axes and force application
• Ultra-low noise and vibration

Critical Force Control Capabilities for Bonding Processes

To address these challenges, advanced motion controllers must deliver a combination of real-time precision and flexibility.

1. High-Bandwidth Force Loops

Fast dynamic response is essential to:

• Detect initial contact without overshoot
• Regulate force during bonding
• Adapt to material deformation

2. Sensor-Based and Sensorless Force Modes

Modern systems leverage both:

• Sensor-based force control (load cells, force sensors) for maximum accuracy
• Sensorless force control using motor current/observer models for cost and integration advantages

These modes can be switched dynamically depending on the bonding stage.

3. Smooth Force Profiles and Multi-Segment Control

Hybrid bonding and TCB processes require:

• Controlled force ramp-up and ramp-down
• Multi-stage profiles (approach, contact detect, compression, hold, release)

Advanced control platforms support multi-segment force profiles to optimize each phase of the bonding cycle.

4. Real-Time Mode Switching (Position Force)

Bonding sequences depend on:

• Precise positioning during alignment
• Immediate transition to force control during contact

This requires deterministic switching with no discontinuities—ensuring process stability and repeatability.

5. Synchronization Across Axes and Systems

In advanced tools, bonding is not an isolated axis:

• Z-axis force must be synchronized with XY alignment stages
• Thermal systems must be coordinated with force application
• High-speed automation systems must maintain cycle time targets

ACS platforms, for example, provide real-time multi-axis synchronization and deterministic control, enabling cohesive system-level performance.

Applying Force Control to Hybrid Bonding

In hybrid bonding, the bonding quality depends on:

• Initial oxide-to-oxide contact (low force regime)
• Followed by metal (Cu-Cu) interconnect formation (higher force/thermal regime)

Force control enables:

• Gentle contact detection to avoid particle-induced defects
• Controlled transition to compression phases
• Accurate force distribution to ensure uniform bond formation across micro-bumps or pads

Because hybrid bonding operates at extremely fine pitches, the motion system must combine:

• Sub-micron positioning accuracy
• High-fidelity force regulation
• Minimal mechanical disturbance

Applying Force Control to Thermal Compression Bonding (TCB)

TCB introduces additional thermal dynamics:

• Elevated temperatures soften materials
• Force must be maintained consistently during thermal expansion and deformation

Key force control requirements include:

• Stable force regulation over time and temperature
• Compensation for creep and relaxation effects
• High repeatability for mass production environments

Multi-segment force profiles are especially critical here, ensuring optimal bonding conditions throughout heating, compression, and cooling phases.

Enabling High Throughput Without Sacrificing Precision

A common misconception is that tighter force control compromises throughput. In reality, advanced motion platforms enable both:

• High-speed contact detection reduces cycle time
• Adaptive force control minimizes rework and scrap
• Learning-based algorithms improve repetitive process performance

ACS solutions leverage real-time control, advanced algorithms, and integrated motion/force capabilities to maximize both yield and throughput in semiconductor manufacturing environments.

Conclusion: Force Control as a Strategic Differentiator

As advanced packaging continues to scale—driven by AI, HPC, and chiplet architectures—bonding processes will become even more demanding.

Force control is no longer a secondary feature. It is a core technology differentiator that directly impacts:

• Yield
• Reliability
• Throughput
• Process scalability

For OEM machine builders, investing in advanced motion platforms with integrated, real-time force control is essential to staying competitive in the next generation of semiconductor manufacturing.

The post Maximizing Yield and Throughput in Hybrid & TCB Bonding with Precision Force Control appeared first on ACS Motion Control.

Hybrid bonding is redefining semiconductor manufacturing. As the industry shifts toward 3D integration and chiplet-based architectures, achieving reliable, high-yield bonding requires unprecedented levels of motion precision, speed, and stability.

At the heart of this challenge lies the motion system—especially gantry stages responsible for positioning bonding heads and wafers with extreme accuracy. Traditional control approaches are reaching their limits.

Smarter Gantry Control, powered by advanced MIMO (Multi-Input Multi-Output) algorithms, is emerging as a critical enabler for next-generation hybrid bonding systems.

The Hybrid Bonding Challenge: Extreme Precision Meets Extreme Throughput

Hybrid bonding introduces new motion control requirements that go far beyond legacy packaging:

• Alignment tolerances in the sub-micron to nanometer range
• Dramatically increased number of bonding points
• Faster move-and-settle times to preserve throughput
• Sensitivity to vibration, EMI, and mechanical disturbances

As advanced packaging evolves, the combination of smaller geometries and higher throughput requirements places enormous pressure on motion systems.

In particular, gantry stages used for wafer positioning and bonding must maintain nanometer-level accuracy while moving rapidly across large work areas.

Why Traditional Gantry Control Falls Short

Most gantry systems rely on dual motors driving a shared mechanical structure. While effective for force and travel, this architecture introduces complex challenges:

• Cross-axis coupling between motors
• Mechanical yaw and beam distortion
• Load-dependent performance variation
• Disturbances propagating across axes

Traditional control methods treat each axis independently. In hybrid bonding, this approach leads to:

• Positioning errors during fast moves
• Increased settling times
• Reduced bonding accuracy and yield

In short, independent axis control cannot meet the coupled dynamics of hybrid bonding systems.

MIMO-Based Smarter Gantry Control: A System-Level Approach

Smarter Gantry Control solves this problem by treating the gantry as a fully coupled dynamic system, rather than separate axes.

Using advanced MIMO algorithms, ACS motion controllers:

• Coordinate multiple motors as a unified system
• Compensate for interactions between axes in real time
• Maintain consistent performance across the entire working area

This approach delivers:

• Higher control bandwidth
• Improved stability
• More predictable and repeatable positioning

These characteristics are essential for hybrid bonding, where even nanometer-level errors can impact yield.

Key Advantages for Hybrid Bonding Applications

1. Nanometer-Level Positioning Accuracy

Smarter Gantry Control enables ultra-precise positioning required for bonding alignment.

• Supports sub-nanometer resolution and accuracy in advanced packaging processes
• Minimizes yaw and cross-axis errors during motion

This directly contributes to improved bonding alignment and higher yield.

2. Dynamic Cross-Axis Compensation

Hybrid bonding systems experience strong coupling effects during rapid motion.

MIMO control addresses this with:

• Real-time compensation of cross-axis disturbances
• Reduced mechanical interaction between drives
• Improved contour accuracy during movement

This capability improves both accuracy and throughput simultaneously, rather than forcing a trade-off.

3. Faster Move-and-Settle Performance

In hybrid bonding, throughput is driven by how quickly the system can move and stabilize.

Advanced control algorithms enable:

• Reduced settling times
• Faster execution of short-duration moves
• Minimized vibration during positioning

These improvements are key to maintaining throughput as bonding densities increase.

4. Consistent Performance Across the Wafer

Hybrid bonding requires uniform performance regardless of position on the stage.

Smarter Gantry Control delivers:

• Position-independent accuracy
• Stability across full travel range
• Reliable performance under varying loads

This ensures consistent bonding quality across the entire wafer or panel.

5. Simplified Commissioning for Complex Systems

Despite the complexity of MIMO control, integrated tools and algorithms reduce engineering effort:

• Advanced tuning tools streamline optimization
• Automated compensation reduces manual intervention
• Faster time-to-performance for new machine designs

This aligns with OEM needs to accelerate development cycles while meeting tighter specifications.

Real Impact: Improving Yield, Throughput, and Reliability

Hybrid bonding is highly sensitive to motion performance. A single positioning error can result in:

• Misalignment
• Bond failure
• Reduced yield

Smarter Gantry Control directly addresses these risks by:

• Improving alignment precision
• Reducing vibration and disturbance
• Ensuring repeatable positioning

At the same time, faster motion and reduced settling enable higher productivity, supporting the dual requirement of precision and throughput.

Built for the Future of Advanced Packaging

The transition to hybrid bonding and 3D integration is driving demand for:

• Higher precision (<10 µm pad & bump pitch and even much further below)
• Faster process speeds
• More complex multi-axis architectures

These trends make advanced motion control capabilities essential.

ACS solutions combine:

• Multi-axis synchronization
• Advanced servo algorithms
• MIMO-based gantry control
• Scalable EtherCAT architectures

This integrated approach allows OEMs to design machines capable of meeting both current and future hybrid bonding challenges.

Conclusion: Precision Motion as a Competitive Advantage

Hybrid bonding represents a new frontier in semiconductor manufacturing—but it also redefines the requirements for motion control.

Smarter Gantry Control, powered by advanced MIMO algorithms, enables machine builders to:

• Achieve nanometer-level accuracy
• Increase throughput without sacrificing precision
• Ensure consistent, repeatable performance

For OEMs developing next-generation hybrid bonding equipment, motion control is no longer just a subsystem—it is a critical differentiator for performance, yield, and market success.

The post Smarter Gantry and MIMO Control for Hybrid Bonding: Enabling Sub‑Nanometer Precision at Scale appeared first on ACS Motion Control.

ACS Motion Control Introduces “Ace,” an AI‑Powered Smarter Motion Assistant to Accelerate Technical Support for users with an approved ACS website account. Login and look for Ace for on demand support.

New website chatbot delivers 24/7, multilingual access to ACS motion control expertise, combining manuals, application notes, and real‑world support tickets into a single interface.

Yokneam Illit, Israel – July 27, 2026 – ACS Motion Control, a global provider of high‑precision motion control solutions for high‑tech OEM machine builders, today announced the launch of Ace, a new AI‑based “Smarter Motion assistant” integrated into the ACS website. Ace is designed to make it faster and easier for engineers to obtain expert technical support on ACS motion controllers, drives, and development tools, anytime and from anywhere in the world.

Modern high‑precision motion systems—such as multi‑axis XYZT gantries for semiconductor, electronics, laser processing, and biomedical applications—rely on advanced features and sophisticated control algorithms. These capabilities are supported by extensive documentation, including PDFs, application notes, emails, and calls with support engineers, which can take significant time to sift through when troubleshooting or developing new machine features.

Ace addresses this challenge by serving as a front‑line, AI‑powered technical assistant that understands ACS products and technologies and responds in natural language.

Positioned as “your Smarter Motion assistant powered by AI technology,” Ace delivers a set of clear values for ACS customers:

• Available – 24/7 technical support: Engineers can engage with Ace at any time, regardless of local business hours, aligning with the global footprint of ACS customers across the US, Europe, Israel, Singapore, China, and other regions.
• Faster – ask and receive answers quickly: Ace is optimized to provide rapid responses to product and feature questions, helping teams reduce engineering wait times and keep projects moving.
• Comprehensive – answers drawn from multiple data sources: The assistant is grounded in a combined knowledge base that includes the ACS website, user manuals, application notes, and real‑world technical support tickets, providing engineers with context‑rich, implementation‑oriented answers.
• Any Language – support in native languages: Users can ask questions and receive answers in their native language, such as English, German, and Chinese.
• Smarter – continuously trained by ACS experts: Ace is trained using actual support tickets and is continuously monitored and refined by ACS application engineers to maintain accuracy and reflect real‑world solutions.

“Complex motion control applications shouldn’t require complex support journeys,” said Jason Goerges, VP of Marketing, ACS Motion Control. “With Ace, we’re investing in a smarter, AI‑assisted support experience that keeps our customers focused on machine performance, not on searching through documentation.”

Elevating the ACS customer experience

The Ace launch aligns with ACS Motion Control’s long‑standing strategy of pairing high‑performance motion control platforms with expert application and support engineering.

With Ace, ACS is elevating the customer experience with technical support that is faster, smarter, and easier to access—anywhere, in any language—under its “Smarter Motion” vision.

About ACS Motion Control

ACS Motion Control is a global leader in high‑precision motion control systems for OEM machine builders in semiconductor inspection and metrology, advanced packaging, electronics assembly, laser micromachining, biomedical imaging, and other high‑precision applications. Founded in 1985 and headquartered in Israel, ACS operates with subsidiaries in the United States, Germany, and China, supported by a worldwide network of distributors and partners.

ACS offers a broad portfolio of SPiiPlus EtherCAT‑based motion controllers, motion controllers with integrated drives, DS402 EtherCAT servo drives, drive interfaces, laser control interfaces, and auxiliary products, all supported by powerful development tools such as the SPiiPlus ADK Suite and SPiiPlus MMI Application Studio. These platforms integrate advanced servo control algorithms, sophisticated motion profile generation, motion‑to‑process event synchronization, and extensive host‑level libraries to help customers achieve better throughput, higher accuracy, faster development, and greater machine flexibility.

Since 2017, ACS has been a proud member of the Physik Instrumente (PI) Group, continuing to drive a smarter future in motion in close partnership with OEMs worldwide.

Media Contact:
Stacey Gibbs
MarCom Specialist
ACS Motion Control
staceyg@acsmotioncontrol.com
612-816-7304

The post ACS Motion Control Introduces “Ace,” an AI‑Powered Smarter Motion Assistant to Accelerate Technical Support appeared first on ACS Motion Control.

In today’s most advanced semiconductor, electronics, and laser processing equipment, motion control is no longer just about achieving position—it is about achieving precision, synchronization, and throughput simultaneously. As machine architectures evolve toward larger formats, tighter tolerances, and higher speeds, traditional control approaches struggle to keep pace.

This is where Smarter Gantry Control powered by MIMO (Multi-Input Multi-Output) algorithms plays a decisive role.

The Challenge: Coordinating Coupled Axes in Gantry Systems

Gantry stages are foundational to many high-performance systems—from wafer inspection tools to advanced packaging platforms. These systems typically utilize multiple motors driving a single mechanical structure, such as an X-axis beam carried by dual drives.

While this architecture enables higher force and longer travel, it introduces complex dynamic challenges:

• Mechanical coupling between axes (cross-axis interaction)
• Structural flex and yaw errors
• Varying loads across the beam
• Disturbances generated by one axis affecting another

In conventional control approaches, each axis is treated independently (SISO control). However, in a gantry system, axes are inherently interdependent, and ignoring this coupling leads to:

• Reduced accuracy
• Lower bandwidth
• Increased settling times
• Limited throughput

Moving Beyond SISO: The Power of MIMO Control

MIMO control fundamentally changes how motion systems are managed. Instead of treating each axis in isolation, MIMO considers the entire system as a coupled dynamic entity, where multiple inputs (drive commands) influence multiple outputs (axis positions and errors).

ACS’s Smarter Gantry Control leverages advanced MIMO algorithms to:

• Actively compensate for cross-axis interactions
• Coordinate multiple motors as a single synchronized system
• Maintain performance consistency across the stage travel

This approach enables higher bandwidth, improved stability, and more predictable system behavior, even in complex mechanical configurations.

Smarter Gantry Control: Key Innovations

ACS’s implementation of Smarter Gantry Control introduces several critical capabilities designed for high-end precision systems:

1. Dynamic Cross-Axis Compensation

Instead of reacting to errors after they occur, the system dynamically compensates for the impact of the moving cross-axis load changing the overall systems behavior.

• Minimizes cross-coupling errors
• Reduces beam skew (yaw)
• Improves contour accuracy

This directly translates into better throughput and positioning performance.

2. Dynamic Error Compensation

Advanced algorithms continuously correct system-level errors that arise from:

• Structural compliance
• Thermal variation
• Load changes

These corrections ensure consistent nanometer-level accuracy, even under varying operating conditions.

3. Position-Independent Performance

Traditional gantry tuning often depends heavily on position. Performance degrades at the extremes of travel or under different load conditions.

MIMO-based control eliminates this limitation by delivering:

• Uniform performance across the entire working envelope
• Consistent accuracy independent of axis position

This is especially critical in applications like wafer inspection and hybrid bonding, where uniformity is essential.

4. Simplified Tuning and Optimization

Despite the complexity of multi-axis dynamics, Smarter Gantry Control simplifies implementation:

• Integrated tools like FRF Analyzer enable efficient tuning
• Advanced algorithms reduce manual tuning effort
• Robust performance across a wide range of stage designs

This allows engineers to achieve high performance faster, reducing time to market.

Real-World Impact: From Nanometers to Throughput

In advanced packaging and inspection systems, Smarter Gantry Control directly enables:

• Sub-nanometer positioning accuracy for bonding and metrology applications
• Faster move-and-settle times, increasing machine throughput
• Reduced vibration and improved process stability
• Higher yield through improved positioning precision

For example, bonding applications require extremely tight alignment tolerances. By combining MIMO control with advanced servo algorithms, systems achieve both speed and precision without compromise.

Why It Matters for Next-Generation Machines

As industries push toward:

• Smaller feature sizes
• Higher process speeds
• More complex multi-axis machine architectures

The limitations of traditional control approaches become increasingly evident.

Smarter Gantry Control addresses these challenges by enabling:

• Scalable performance for complex machines
• Robust handling of coupled mechanical systems
• Integration with advanced algorithms such as learning-based control and force control

This positions OEMs to build machines that are not only faster and more precise, but also more adaptable to future requirements.

Conclusion: Intelligent Control for Intelligent Machines

The transition from conventional SISO control to advanced MIMO-based Smarter Gantry Control represents a fundamental step forward in motion system design.

By treating the gantry as an integrated, dynamic system rather than a collection of independent axes, engineers can unlock:

• Higher accuracy
• Greater throughput
• Improved system robustness

In the era of advanced packaging, precision inspection, and high-speed manufacturing, this shift is not just beneficial—it is essential.

The post Smarter Gantry and MIMO Control: Unlocking the Next Level of Precision Motion appeared first on ACS Motion Control.

ACS Motion Control is pleased to announce the release of SPiiPlus ADK Suite v4.20.01, the latest version of our comprehensive software platform for developing, deploying, and maintaining advanced motion control applications.

Version 4.20.01 builds on the innovations introduced in the 4.20 release series and delivers additional refinements, stability improvements, and expanded support for new ACS hardware platforms. Users currently running version 4.20 are strongly encouraged to upgrade to take advantage of these enhancements.

Continued Access to Advanced 4.20 Features

Version 4.20.01 includes all major capabilities introduced in the 4.20 release series, including:

• Support for the latest ACS hardware platforms
• User-Defined Algorithms (UDA) for custom control loop implementation (beta)
• Enhanced motion analysis and visualization capabilities
• New and updated ACSPL+ commands and variables
• Performance and usability improvements throughout the development environment

These capabilities help developers accelerate machine innovation while maintaining deterministic performance in demanding motion applications.

Important Notice for Current Users

SPiiPlus ADK Suite v4.20.01 replaces version 4.20. ACS recommends that all users currently running v4.20 upgrade to the latest release to ensure access to the newest enhancements, hardware support, and software improvements.

Download SPiiPlus ADK Suite v4.20.01 today.

The latest version is now available for download from the ACS website.

For detailed information about all updates, supported products, and compatibility requirements, please refer to the release notes included with the software package.

The post SPiiPlus ADK Suite v 4.20.01 Now Available – Replacing Previous v 4.20 appeared first on ACS Motion Control.

A New Generation of SPiiPlus Drive Modules

The UDMac is a 2‑axis drive module within the SPiiPlus EtherCAT platform, engineered to drive medium‑power stages. It operates from 85-265 Vac and is available in 5/10 A or 10/20 A current configurations, meeting modern CE, UL, and functional safety (STO) standards. Designed as the replacement for the UDMpm, the UDMac brings updated performance, stronger integration, and forward compatibility with the evolving PX‑series motion control architecture.

The platform’s flexible power stage architecture allows OEMs to scale from economical entry‑level axes to high‑performance multi‑axis subsystems—while maintaining a unified controls environment through the SPiiPlus control suite.

Integrated into the SPiiPlus Ecosystem

The dual‑axis drive module is compatible with current and future PX‑series controllers, ensuring long‑term alignment with ACS’s next‑generation control roadmap.

New features include:

• Advanced motion algorithms such as LearningBoost Robust Mode for enhanced performance under aggressive, high‑dynamics motion conditions.
• User Defined Algorithms (UDA), enabling machine builders to implement their own C/C++‑based servo logic into ACS controllers and drives for custom motion strategies.
• Tool Normal, enhanced PEG, and expanded MMI diagnostics, all of which are supported across the platform.
• PEG Pulse Train, generate PEG pulses without motion simplifying application development & troubleshooting. 

Positioning Within the SPiiPlus Platform

Within the broader SPiiPlus ecosystem, the UDMac occupies a key role in ACS’s “medium power stage” tier, complementing:

• CMac-PX, an EtherCAT controller with 1- or 2-integrated drives.
• ECMac, an integrated controller‑drive module for compact 2‑axis cost-sensitive systems.
• MC4U‑PX (coming soon), the flagship high‑performance controller with NanoPWM Plus technology (coming soon) for ultra‑precision semiconductor machinery.

This structured portfolio allows OEMs to standardize across a common programming language (ACSPL+), a unified diagnostics environment, and a modular EtherCAT‑based hardware ecosystem.

Reach out to your ACS sales representative or sales@acsmotioncontrol.com for more details.

The post ACS Motion Control Introduces UDMac: Next‑Generation Medium-Power EtherCAT^® Servo Drive for the SPiiPlus Motion Platform appeared first on ACS Motion Control.

ECMac: Integrated Control for Cost‑Sensitive Sub-Micron Precision Systems

The ECMac is a dual‑axis, AC‑input motion controller with 1 or 2 integrated servo drives, designed to control compact motion systems requiring medium‑power stages. Operating from 85-265 Vac and supporting 5/10 A or 10/20 A drive configurations, ECMac brings modern CE, UL, and STO functional‑safety compliance to space‑ and cost‑constrained applications.

Typical applications include:

• 2‑axis wafer positioning modules
• XY or R‑Theta stages
• Fixed mounted inspection/metrology heads

How ECMac Fits Within the ECM Product Line

The ECM family represents ACS’s suite of integrated controller‑drive modules that combine SPiiPlus motion control with compact, AC‑input servo power stages. The release of ECMac extends the ECM product line’s value by offering:

1. A Unified Approach to Entry‑Level to Mid‑Range Precision Control

Earlier ECM controllers provided integrated servo control for 1–2 axis systems and targeted OEMs who required precise motion without the footprint or complexity of modular multi‑axis racks.

The ECMac strengthens this positioning by offering updated electrical ranges (85-265 Vac, 5/10 A and 10/20 A) and integrated safety.

2. A Consistent Architecture Across ECM and Related Product Families

ECMac complements:

• CMac-PX, an EtherCAT controller with integrated entry‑level drives for 1–2 axis cost‑sensitive systems
• UDMac, an EtherCAT drive module for cost‑sensitive medium‑power stages

Together, these products form a unified control layer that OEMs can deploy across multiple axes, machine types, and performance tiers—while maintaining a consistent ACSPL+ programming model and shared development & diagnostics environment.

Why ECMac Matters to OEMs

With ECMac, machine builders gain a compact controller‑drive module that:

• Reduces cabinet complexity and wiring
• Supports modern safety and global compliance requirements
• Delivers deterministic multi‑axis performance

For equipment manufacturers developing high‑volume precision tools—such as inspection systems, small wafer modules, or compact automation stages—ECMac offers a compelling mix of integration, affordability, and performance.

Reach out to your ACS sales representative or sales@acsmotioncontrol.com for more details.

The post ACS Motion Control Announces ECMac: Strengthening the ECM Family of Compact, Cost‑Optimized Integrated Motion Controllers appeared first on ACS Motion Control.

Engineered for streamlined integration into compact motion systems, the CMac‑PX is an advanced EtherCAT motion controller with dual‑axis AC‑input drives that offers a cost‑effective motion solution while maintaining ACS’s hallmark precision and reliability. Utilizing EtherCAT, the CMac-PX is expandable with additional external drive axes, I/O modules, laser control and more.

Next‑Generation Performance

The CMac‑PX is the latest Control Module which includes the latest generation PX-series motion controller core to provide higher EtherCAT updates and more computing power.

Key features of CMac-PX:

• EtherCAT motion controller with up to 10 kHz update rates and up to 64 axes of control

• Dual‑axis AC‑input drives: 85-265 Vac with 10/20 A output per axes
• Full SPiiPlus ADK Suite 4.20 support, ensuring alignment with ACS’s latest development tools, diagnostics, and advanced motion capabilities.
• Part of ACS’s expanding PX‑series controller portfolio, complementing high‑performance products such as MC4U‑PX (coming soon) and the EC-PX + UDMac.

Optimized for Cost‑Sensitive Multi‑Axis Precision Motion Systems Platforms

Positioned as a motion control solution for OEMs building compact inspection, metrology, and small‑frame semiconductor subsystems, the CMac‑PX is great for controlling XY or XX’ gantry configurations plus the expansion & synchronization benefits of EtherCAT‑based distributed architectures, ensuring expadability without compromising machine performance.

Strengthening ACS’s Motion Portfolio

Combined with the ECMac and UDMac releases, ACS continues to expand its medium-power product offering for cost‑conscious machine segments while maintaining a high level of performance. The ECMac, designed for 1‑ or 2‑axis applications with integrated servo drives, offers an ideal entry point for compact, cost‑sensitive motion systems such as XY or R‑Theta stages. Complementing it, the UDMac provides a 1‑ or 2‑axis EtherCAT servo drive that pairs seamlessly with both current and future SPiiPlus PX‑series controllers, giving OEMs a flexible, scalable path to higher performance when needed.

Together, these modules deliver controller & drive solutions with a coherent, software‑compatible ecosystem that preserves the user experience of ACS’s flagship SPiiPlus Platform. 

Reach out to your ACS sales representative or sales@acsmotioncontrol.com for more details.

The post ACS Motion Control Announces CMac‑PX: New Dual‑Axis EtherCAT^® Drive & Controller for Sub-micron Precision appeared first on ACS Motion Control.

FOR IMMEDIATE RELEASE
ACS Motion Control Announces SPiiPlus ADK Suite v4.20, Delivering Powerful New Control Capabilities and Expanded Product Support

Date April 13th, 2026 — Yokneam Illit, Israel — ACS Motion Control today announced the release of its SPiiPlus ADK Suite version 4.20, a major update to the company’s industry‑leading development environment for high‑precision motion control applications. The new version delivers significant product additions, enhanced control algorithms, expanded platform support, and improvements across the SPiiPlus development ecosystem, enabling OEMs to accelerate innovation in semiconductor, electronics, laser processing, and advanced manufacturing systems.

Platform, Firmware & Compatibility Updates

The new release maintains full backward compatibility with previous SPiiPlus versions and supports operating systems including Windows 10/11, Server editions, multiple Linux distributions (x64 & ARM64), and macOS. Firmware 4.20 requires compatible hardware revisions for specific product families, detailed in the release notes.

Availability

The SPiiPlus ADK Suite v4.20 is available immediately to authorized ACS Motion Control customers. For more information, refer to the SPiiPlus ADK Suite v4.20 Release Notes or contact your dedicated ACS sales representative, sales@acsmotioncontrol.com.

The post SPiiPlus ADK Suite v 4.20 Now Available: Expanded Hardware and Enhanced Control Capabilities appeared first on ACS Motion Control.

As sequencing technologies push toward higher throughput, smaller reagent volumes, and more complex imaging and detection techniques, motion control requirements have escalated dramatically. Today’s genome sequencing machines behave more like advanced semiconductor inspection platforms than traditional lab equipment—and they demand equally sophisticated motion systems.

Why Motion Control Matters in Genomics

Modern platforms—whether based on optical fluorescence, nanopore sensing, single‑molecule real‑time (SMRT) detection, or emerging enzymatic approaches—require:

• Nanometer-scale positioning over range of travel
• Real‑time synchronization between motion and imaging
• Ultra‑smooth velocity and force profiles
• High‑speed step‑and‑scan movement to maximize throughput
• Multi‑axis coordination across stacked or hybrid (coarse + fine) stages

This blend of precision, speed, and stability is exactly where advanced motion controllers separate high‑performance sequencers from their competitors.

The Core Motion Challenges Inside Sequencing Systems

1. Ultra‑High Positional Accuracy Across Large Work Areas

Flow cells, wafers, slides, and consumables used in sequencing often span large surfaces, but detection still relies on sub‑micron or nanometer‑level alignment.
This requires:

• High‑resolution linear encoders
• Multi‑degree‑of‑freedom stage architectures
• Advanced error mapping and compensation
• Thermal‑drift mitigation for long‑run stability

These are the same types of challenges seen in metrology and semiconductor inspection, making high‑end motion platforms a natural fit.

2. Deterministic Motion-to-Process Synchronization

Optical sequencing systems depend on tightly coordinated timing between:

• Stage motion
• Illumination
• Camera exposure
• Fluidic actuation

Technologies like Position Event Generation (PEG) enable sequencers to trigger imaging or sensing based on exact encoder positions—ensuring consistent data quality, pixel‑to‑pixel alignment, and reliable chemistry cycles.

3. Multi‑Axis Coordination for Hybrid Motion Systems

Next‑gen sequencing machines increasingly use coarse/fine stacked architectures:

• Long‑travel XY or XYZ stages for global positioning
• Piezo or voice‑coil stages for nanometer‑resolution focus control
• Rotational or tilt axes for optical alignment

Coordinating these systems requires:

• Deterministic multi‑axis synchronization
• High‑speed servo loops
• Real‑time sensor fusion (encoders, force sensors, vision)

This is where advanced control algorithms—like dynamic error compensation, ServoBoost, and adaptive control techniques—deliver real performance gains.

4. Force Control for Contact‑Sensitive Operations 

Certain sequencing platforms include contact‑sensitive processes such as:

• Probe‑to‑surface interactions
• Mechanical tissue dissociation
• Microfluidic cartridge insertion
• Soft‑touch engagement for optical modules

Closed‑loop force control —with soft‑landing, multi‑segment force profiles, and real‑time adjustment—prevents damage, improves reliability, and reduces consumable variability.

How Precision Motion Control Drives Better Sequencing Outcomes

• Higher Throughput

Faster, smoother stage motion reduces cycle time per imaging field or sensing location. High‑speed triggering enables rapid‑fire acquisition without sacrificing image quality.

• Greater Accuracy and Yield

Nanometer‑level precision improves:

• Base‑calling accuracy
• Signal‑to‑noise ratio
• Fluidic alignment
• Optical stability

This directly impacts read length, chemistry efficiency, and overall yield.

• More Stable, Reliable Instruments

Advanced servo algorithms compensate for:

• Mechanical imperfections
• Thermal distortion
• Structural vibration
• Encoder nonlinearities

Result: better performance without the cost of over‑engineered mechanics.

The Future of Gene Sequencing Depends on Motion

As genomic sequencing moves toward real‑time diagnostics, massively parallel architectures, and integrated multi‑omics, motion systems will become even more critical resulting in:

• Tighter integration of motion with AI‑driven image analysis
• Expanded use of multi‑DOF mechanisms
• Increased reliance on digital twins for stage and process simulation
• High‑speed synchronization between motion, imaging, and fluidics
• More robust force‑feedback and sensor‑fusion control

The genomics revolution isn’t just about chemistry—it’s equally about the machines that make the chemistry possible. Precision motion control is the silent enabler accelerating discoveries, improving data quality, and bringing the next generation of sequencing tools to market faster.

The post How Precision Motion Control Is Powering the Next Wave of Genomic Sequencing Innovation appeared first on ACS Motion Control.