Force Control
Precision force control with on-the-fly contact detection
Advanced semiconductor packaging and electronics assembly/test applications require highly accurate control of forces applied by precision motion stages during a contact-based process. ACS’ Force Control algorithm, available in select servo drives, solves challenges associated with meeting the demanding throughput and accuracy targets of these applications:
- Detecting contact reliably (without false positives or negatives) and switching instantaneously from position control mode to force control mode
- Settling to the target force immediately after contact
- Performing rapid actuator moves without exciting resonances
Key Benefits
- Can achieve high levels of force control accuracy (e.g. +/-0.01N)
- Enables high levels of stage acceleration (e.g. >> 1G) and process throughput
- Straightforward configuration procedure
- Suitable for open-loop and closed-loop use cases
- Suitable for voice coil stages, linear motor stages
Key application use cases
- Hybrid bonding
- TC (thermo-compression) bonding
- Die bonding
- LED bonding
- Wire bonding
- Wafer probing and test
- Silicon Photonics assembly and test
- Electronics assembly and test
Relevant Resources
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Accelerating motion control solutions & high-tech equipment innovation
Since our founding, ACS Motion Control has thrived on addressing precision motion control challenges in advanced semiconductor process control. Today, we are proud to provide motion control system solutions to equipment manufacturers in several high-tech market segments.
Ultra-precise, high-speed motion coordination
Compact, compliant, high-reliability control solutions
Ultra-precise, high-speed motion coordination
Nanometer stability for critical beam positioning